Silicon Based Ion Emitter Assembly

ABSTRACT

An embodiment of the invention provides a method for low emission charge neutralization, comprising: generating a high frequency alternating current (AC) voltage; transmitting the high frequency AC voltage to at least one non-metallic emitter; wherein the at least one non-metallic emitter comprises at least 70% silicon by weight and less than 99.99% silicon by weight; wherein the at least one emitter comprises at least one treated surface section with a destroyed oxidation layer; and generating ions from the at least one non-metallic emitter in response to the high frequency AC voltage. Another embodiment of the invention provides an apparatus for low emission charge neutralization wherein the apparatus can perform the above-described operations.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation-In-Part of and claims priority to U.S. application Ser. No. 12/456,526, filed 18 Jun. 2009, entitled “SILICON EMITTERS FOR IONIZERS WITH HIGH FREQUENCY WAVEFORMS” which claims the benefit of and priority to U.S. Provisional Application No. 61/132,422, filed 18 Jun. 2008. U.S. application Ser. No. 12/456,626 and 61/132,422 are both hereby incorporated herein by reference.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH

Not Applicable

REFERENCE TO A MICROFICHE APPENDIX

Not Applicable

BACKGROUND OF THE INVENTION

1. Field of the Invention

Embodiments of the invention primarily relate to ionizing devices that are used for static charge neutralization and control. More specifically, embodiments of the invention are targeted at the need for reliable and low particle emission ionizers within the semiconductor, electronics, and/or flat panel industries.

With AC ionizers, each emitter receives a high positive voltage during one time period and a high negative voltage during another time period. Hence, each emitter generates corona discharge with output of both positive and negative ions.

A stream (cloud) of positive and negative ions is directed toward a charged target(s) for the purpose of neutralizing the charges and preventing static charge associated technological problems.

2. Description of Related Art

The background description provided herein is for the purpose of generally presenting the context of the present disclosure. Work of the presently named inventors, to the extent the work is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against this present disclosure.

Ion emitters of charge neutralizers generate and supply both positive ions and negative ions into the surrounding air or gas media. To generate gas ions, the amplitude of the applied voltage must be high enough to produce a corona discharge between at least two electrodes arranged as an ionization cell. In the ionization cell, at least one electrode is an ion emitter and another one may be a reference electrode. Also it is possible that the ionization cell includes at least two ionizing electrodes.

Along with useful positive gas ions and negative gas ions, emitters of charge neutralizers may create and emit corona byproducts including unwanted particles. In a semiconductor process and similar clean processes, particle emission/contamination correlate with defects, product reliability problems, and lost of profits.

Several known in the art factors influence the quantity of unwanted particles emission. Some of primer factors include, for example, the material composition, geometry, and design of the ion emitter. The second one includes the arrangement of the emitter connection to a high voltage power supply. Another critical factor is associated with a profile of electrical power (magnitude and time dependence of high voltage and current) that is applied to the ion emitters.

The power waveforms can be used to control the voltage profile that is applied to the emitters by the high voltage power supplies. Voltage/current waveforms can be used to control both ion generation and particle emission by emitter(s).

Corona discharge can be energized by DC (direct current) voltage, AC (alternating current) voltage, or a combination of both voltages. For many applications of this invention, a preferable power waveform is a high frequency high voltage (HF-HV) output from a high frequency (HF) power supply, as will be discussed below. This high voltage output may be continual rather than continuous. That is, the voltage output may be variable by amplitude in time or turned off periodically.

The material composition of emitters is known to affect particle emission levels of ionizers. Common emitter materials include stainless steel, tungsten, titanium, silicon oxide, single crystal silicon, silicon carbide, and other nickel or gold plated metals. This list is not complete. From the experience of the inventors, metallic type emitters are prone to generate more particles as a result of corona associated erosion and spattering. Moreover, metallic or, in general, highly conductive particles are often considered as “killer particles” in the semiconductor industry (i.e., the particles are able to short-circuit tightly positioned conductive traces of wafers/chips). So, in the frame of this patent application the inventors basically consider non-metallic ion emitters, as will be discussed below.

In one of these materials, a super clean (more than 99.99% plus purity) single crystal silicon is suggested by Scott Gehlke in U.S. Pat. No. 5,447,763 from the viewpoint of low particle emission. This single crystal silicon has been adopted by the semiconductor industry as a de-facto clean emitter standard. A super clean silicon carbide (at least 99.99% pure) suggested by Curtis et al. in U.S. patent application publication No. 2006/0071599 is another non-metallic material. However, silicon carbide emitters are expensive and prone for emission of undesirable particles.

Known ionizers with single crystal silicon emitters are powered by two high voltage DC supplies. A system, like the room ionization system “NiLstat” 5000 (Ion Systems, Inc.) for cleanroom ceiling installation, typically produces less than 60 particles per cubic foot of air that are greater than 10 nanometer (diameter). Other emitter materials typically produce more than 200 particles per cubic foot of air that are greater than 10 nanometer (diameter). Some materials produce thousands of particles per cubic foot of air that are greater than 10 nanometer (diameter).

Although some of (1) components of emitter materials, (2) elements of connector construction for a non-metallic emitter, and (3) application of special power waveforms may be known to be independently important, the prior art has not considered the benefits of strategically combining these factors to reach high ionization reliability and cleanliness.

Recent experiments by the inventors have resulted in the inventors discovering and finding novel combinations that lead to stable ion production and unpredictably low levels of particle generation by the emitter. Clean and/or low particle emission ionizers have utility in several high technology industries. In particular, the semiconductor industry has a well-defined need for super clean ionizers. The ionizers are needed to minimize static charges and electrical fields, which can destroy semiconductor devices. As low as possible particle emission is also required because foreign particles may compromise the reliability of semiconductor devices. Leading edge semiconductor technology is building 24-16 nanometer features on wafers. For the nanometer features, control of particles greater than 10 nanometers is absolutely needed.

It is to be understood that both the foregoing general description in the background section are exemplary and explanatory only and are not restrictive of the invention, as claimed.

BRIEF SUMMARY OF THE INVENTION

Recent experiments by the inventors have shown that (1) the composition of silicon based material and emitter design, (2) the arrangement and/or construction of the emitter connector, and (3) the type of power voltage waveforms should be considered as a complex novel beneficial combination for reliable performance of and low particle emission by the emitter. Found combinations by the inventors lead to stable ion production and unpredictably low levels of particle generation by the emitter. Clean and/or low particle emission ionizers have utility in several high technology industries. In particular, the semiconductor industry has a well-defined need for super clean ionizers. The ionizers are needed to minimize static charges and electrical fields, which can destroy semiconductor devices. As low as possible particle emission is also required because foreign particles may compromise the reliability of semiconductor devices. Leading edge semiconductor technology is building 24-16 nanometer features on wafers. For the nanometer features, control of particles greater than 10 nanometers is absolutely needed.

Matching of the emitter electrode composition comprising silicon based material, electrode connector, and power waveform that is applied to the emitter have proven to be a novel method of achieving previously unattainable levels reliability and cleanliness of a charge neutralizing ionizer. The core of exemplary embodiments of this invention is the combination of the following: non-metallic ion emitter having material/chemical composition in the range between less than 99.99% to at least 70% silicon by weight, emitter electrode design and surface treatment (preparation), connection arrangement for the emitter, and operating in a high frequency range high voltage power supply. In this combination the high frequency high voltage power generates mode of corona discharge featured by low onset voltages. The ions generated from at least one non-metallic emitter in an embodiment of the invention comprises positive ions and negative ions that are generated at minimum onset HF voltage and power.

This combination is effective and applicable for many different types of clean room ionizers/charge neutralizers. As an example, an ionizer in an embodiment of the invention can be considered an in-line ionizer targeted for a class 1 cleanroom production environment. This ionizer may have an incoming flow of clean dry air (CDA) or nitrogen, argon, or other noble gas. The gas or air passes along the silicon based emitter inside an ionizing cell. The ionizing cell/chamber is typically enclosed except for the air/gas inlet and outlet openings.

The design of an in-line charge neutralizing ionizer according to embodiments of the invention can be using a compact power source like high frequency high voltage supply. An output connector of the power supply accommodates at least one silicon based emitter. An ionization cell produces clean bipolar ionization. The air stream (or nitrogen or argon stream or other gas stream) suffices to move the ions from the ionizing emitter (cell or chamber) to a target of charge neutralization.

The high frequency voltage profile of the power supply has an AC frequency range of approximately 1 KHz to 100 kHz. Peak voltages exceed the corona onset voltages (positive and negative) of the emitters. An ion current of the emitter at high frequency AC is substantially limited by the electrical resistance of the silicon based material.

Within this instant application, high voltages are defined as the difference in potentials between at least one ion generating electrode and the reference electrode. In some high frequency AC ionizing cells the reference electrode can be isolated from the ionizing electrode by dielectric wall. Therefore, possibilities of direct electrons, ions avalanches (like spark discharge) between electrodes are practically excluded and particle emission from the emitter is greatly diminished. During operation mode ions are generated whenever the voltage amplitude exceeds the corona positive and negative onset voltages applied to the ionizing electrode.

Another frequency (optional) becomes pertinent when the high frequency AC voltage profile is periodic rather than continuous. That is, the high frequency AC voltage exceeding the onset voltage profile is generated only within predefined time intervals. In this scenario, the high frequency AC voltage is applied to the emitters during active time intervals (typically approximately 0.01 second or less to approximately 1 or more seconds), but a lower than onset voltage can be applied during inactive time intervals. This optional high frequency voltage waveform may also include essentially an on/off high voltage mode. A normal low voltage or on/off frequency range is approximately 0.1 Hertz to 500 Hertz, but the frequency may lie outside this range.

Some silicon-containing emitter compositions are provided as examples. They are: (a) doped crystal silicon, (b) doped poly silicon, (c) combination doped silicon and silicon oxide, and (d) deposited on substrate doped silicon. Dopants and additives are mainly targeted to control surface and volume electrical resistivity, as well as the mechanical property of silicon based emitters. They preferably are taken from known non-metallic dopant groups like boron, arsenic, carbon, phosphorous, and others.

Accordingly, at least one exemplary embodiment of the invention provides a method for low emission charge neutralization, comprising: generating a high frequency alternating current (AC) voltage; transmitting the high frequency AC voltage to at least one non-metallic emitter; wherein the at least one emitter comprises at least 70% silicon by weight and less than 99.99% silicon by weight; wherein the at least one non-metallic emitter comprises at least one treated surface section with a destroyed oxidation layer; and generating ions from the at least one non-metallic emitter in response to the high frequency AC voltage.

At least one exemplary embodiment of the invention also provides an apparatus comprising elements that permit the above-described functionalities. For example, an embodiment of the invention provides an apparatus for low emission charge neutralization, comprising: at least one non-metallic emitter comprising at least 70% silicon by weight and less than 99.99% silicon by weight; wherein the at least one non-metallic emitter comprises at least one treated surface section with a destroyed silicon oxide layer; and wherein the at least one non-metallic emitter generates ions in response to the high frequency AC voltage.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate one (several) embodiment(s) of the invention and together with the description, serve to explain the principles of the invention.

BRIEF SUMMARY OF THE FIGURES

Non-limiting and non-exhaustive embodiments of the invention are described with reference to the following figures, wherein like reference numerals refer to like parts throughout the various views unless otherwise specified.

It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.

FIG. 1(a) is an illustration of a conventional single crystal silicon ion emitter, or (in general) a non-metallic ion emitter.

FIGS. 1(b) and 1(c) show illustrations of conventional parts and an assembly of a single crystal silicon emitter with metal sleeves and grooves.

FIG. 2 shows an illustration of a conventional DC room ionization ceiling system with two single crystal silicon emitters.

FIG. 3(a) shows an illustration of a silicon-containing emitter, according to an embodiment of the invention, wherein the emitter comprises a section of the emitter shaft having a preselected surface roughness (or a treated surface section).

FIG. 3(b) shows an illustration of an emitter, according to another embodiment of the invention, wherein the emitter comprises a section of the emitter shaft having a partial conductive surface plating or partial conductive surface coating (or treated surface section of other types).

FIG. 3(c) shows an illustration of a silicon-containing emitter and an apparatus to monitor the surface electrical resistance and/or volume electrical resistance of the emitter, in accordance with an embodiment of the invention.

FIGS. 4(a) and 4(b) show illustrations of a silicon-containing emitter with two variants of radial compression spring sleeves and metal pins, in accordance with various embodiments of the invention.

FIGS. 5(a), 5(b), and 5(c) show illustrations of three silicon-containing emitters that have different configurations of the taper and tip, in accordance with various embodiments of the invention.

FIG. 6 shows an illustration of an HF waveform to perform “soft” plasma cleaning of a silicon-containing emitter tip during “start up” of corona ionization period, in accordance with an embodiment of the invention.

FIGS. 7(a), 7(b), and 7(c) show illustrations of examples of high frequency power voltage wave forms applied to a silicon based emitter during an operational mode, in accordance with various embodiments of the invention.

FIGS. 8(a) and 8(b) show illustrations of examples of modulated high frequency voltage wave forms, in accordance with various embodiments of the invention.

FIG. 9(a) shows an illustration of an ionizing cell/chamber of an in-line ionizer, in accordance with an embodiment of the invention. A high frequency AC powered silicon based emitter generates both polarity ions. An air/gas flow is moving the stream of ions from the emitter.

FIG. 9(b) shows an illustration of the gas channel and the ionization cell, in accordance with an embodiment of the invention.

FIG. 9(c) shows a simplified block diagram of an in-line ionizer with a silicon based emitter, in accordance with an embodiment of the invention.

FIGS. 10(a), 10(b), 10(c), and 10(d) show illustrations of a simplified structure of a high frequency AC ionizing bar, and details of nozzles with silicon based ion emitters, in accordance with an embodiment of the invention.

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation, numerous specific details are set forth to provide a thorough understanding of the various embodiments of the present invention. Those of ordinary skill in the art will realize that these various embodiments of the present invention are illustrative only and are not intended to be limiting in any way. Other embodiments of the present invention will readily suggest themselves to such skilled persons having the benefit of this disclosure.

In addition, for clarity purposes, not all of the routine features of the embodiments described herein are shown or described. One of ordinary skill in the art would readily appreciate that in the development of any such actual implementation, numerous implementation-specific decisions may be required to achieve specific design objectives. These design objectives will vary from one implementation to another and from one developer to another. Moreover, it will be appreciated that such a development effort might be complex and time-consuming, but would nevertheless be a routine engineering undertaking for those of ordinary skill in the art having the benefit of this disclosure. The various embodiments disclosed herein are not intended to limit the scope and spirit of the herein disclosure.

Exemplary embodiments for carrying out the principles of the present invention are described herein with reference to the drawings. However, the present invention is not limited to the specifically described and illustrated embodiments. A person skilled in the art will appreciate that many other embodiments are possible without deviating from the basic concept of the invention. Therefore, the principles of the present invention extend to any work that falls within the scope of the appended claims.

As used herein, the terms “a” and “an” herein do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced items.

Experimentally, it has been shown by the inventors that, for example, an in-line ionizer combining (1) silicon-containing emitter (2) configured as a pin type electrode in contact with a conductive socket and capacitive receiving (3) a high frequency AC voltage waveform reliably produces an electrically balanced ion gas stream with very few particles. The above-noted combination creates ionization with reliability and cleanliness levels that cannot be reached separately by either known in the art non-metallic silicon-containing emitters or the high frequency AC voltage waveform. Cumulative particles greater than or equal to 10 nm in diameter were measured during cleanliness testing. The particle counters (like CNC—condense particle counter) did not separate particles into size ranges.

For example, two single crystal silicon emitters for a clean room ionization system (e.g., NiLstat ionization system) (similar to the system 200 shown in FIG. 2) connected to a DC or pulsed DC (+/−20 kV) power source (discussed in U.S. Pat. No. 5,447,763) generate roughly 60 particles (greater than 10 nanometers in diameter) per cubic foot of air. In contrast, an ionizer disclosed by an embodiment of the invention typically yields less than 10 same-diameters of nano-particles per cubic foot of air. In perspective, 10 particles per cubic foot of air greater than 10 nanometers is nominally 6 times cleaner than the cleanest prior art ionizers at the time of this application.

In a contrasting example, a metallic emitter (tungsten) was tested with a conventional system (e.g., the system in U.S. Pat. No. 5,447,763) and showed an unacceptable in clean room amount of particle emission. Our experiment to use a tungsten emitter in combination with a high frequency AC high voltage waveform similar to that suggested in U.S. patent application publication No. 2003/0007307 (to Lee et al.) had little benefit in cleanliness compared to that conventional system that was previously disclosed in U.S. Pat. No. 5,447,763. The particle concentration count results in both cases of testing tungsten emitters were above 600 particles (greater than 10 nanometers) per cubic foot of air.

However, a high purity (99.99% plus purity) single crystal silicon emitter (like the emitter shown in FIGS. 1(a), 1(b), and 1(c)) has high electrical resistance (in the mega Ohms range). When this emitter(s) is connected to a high frequency (HF) AC voltage power source often ion production is not enough for efficient charge neutralization. The main reason is because most of the HF (high frequency) electrical current/voltage goes to a stray capacitor but not to the emitter tip.

Another problem associated with a high purity (99.99% plus purity) single crystal silicon emitter is that the emitter is prone to create a surface oxide “skin” (oxide layer or skin shown by dashed line 102 c that surrounds the surface of the silicon emitter 101 c in FIG. 1(c)). This skin/layer 102 c is composed of a highly isolative silicon oxide (SiO₂). Silicon oxide growth on the surface of a clean silicon wafer is discussed, for example, in the following publication by Stanford University, California, “Growth of native oxide” Stanford University Nanofabrication Facility, 28 Aug. 2003.

An end result of the silicon oxide layer growth phenomenon is that a non-metallic silicon emitter/pin is surrounded by this isolative layer and does not have good, reliable connection with an electrical socket and hence to a high voltage output of an HF power supply.

Another non-metallic ion emitter is discussed in U.S. patent application publication No. US 2006/0071599 to Curtis et al. This emitter is made from high purity 99.99% silicon carbide. This material is a composite with about 30% carbon. It is known in the art that silicon carbide has high hardness. Silicon carbide is also expensive in machining to produce as a pin type emitter configuration. Also, silicon carbide has a metallic type high electrical conductance. Conductive particles from a composite with high carbon content are often undesirable in the semiconductor industry.

Wide acceptance of silicon material in the semiconductor industry dictates relatively low cost of the ion emitter material. Moreover, mechanical properties of silicon-based material made machining simple (cutting, polishing, and so on). A small concentration of silicon dopants and additives are mainly targeted to control the surface and volume electrical resistivity, as well as to improve mechanical property of silicon based emitters. They preferably can be taken from known non-metallic dopant groups like boron, arsenic, carbon, phosphorous, and others.

Silicon based composition with silicon content which is less than 99.99% and more than 70% by weight made possible to reach electrical resistance of emitters in the kilo-ohms range, in an embodiment of the invention. This resistance is low enough to conduct high frequency current and to support stable corona discharge. So, the two following certain factors consistently interact to create the observed cleanliness improvement: the composition and design of silicon based emitter and the high frequency AC emitter driving power/voltage waveform.

One of the advantages of the combination of silicon based emitters and HF voltage waveform is that the onset voltage of corona discharge is significantly lower (approximately 1,000 V to 3,000 V or more) than for DC, pulse DC, or low frequency (50 Hz to 60 Hz) voltages for non metallic emitters.

A possible explanation of this effect is that at high frequency in the range (approximately 1 kHz to 100 kHz or more), the voltage applied to the emitter changes polarity in the milliseconds range or micro seconds range. That is why corona charge carriers (positive and negative ions, electrons) do not have enough time to move far away from the emitter tip. Also, specific surface charge conservation (often named as “charge memory”) properties of silicon based material may play a role in electrode surface electron emission. That is why both positive and negative high frequency corona onset voltages are low. With lower voltage of HF corona discharge, the particle emission from the silicon based emitter is also low.

The scientific basis for the particle emission improvement in corona discharge of balanced ionizers due to the interaction between non-metallic silicon based emitter and the high frequency AC voltage waveform is currently being studied. Recognized theories of corona discharge and/or of ionization and/or of particle emission from non-metallic emitters do not predict or completely explain the experimental cleanliness observed.

However, how to make and use the instant invention is clearly understood. The following written description is directed toward explaining how to make and use this invention to one of ordinary skill in the static charge control field.

Experimental works directed to embodiments of the invention comprising a combination of silicon based emitter's composition and HF voltage waveform showed that, in some instances, ionizers with brand new or long time idle emitters show a problem to start HF corona discharge and reliably produce ion generation. Measurements show high contact resistance between the silicon emitters and electrical sockets. This high resistance is one of the reasons for the corona start problem of the ionizing device. Process formation of a relatively thick (in 10th to 100th or more Angstroms) oxide “skin” on silicon wafers in open air are recorded in the above-cited reference, “Growth of native oxide” Stanford University Nanofabrication Facility. For example, during six days, the SiO₂ surface layer can reach thickness of 12 Angstrom. Silicon oxide is known as a good insulator. So, this skin growth results in a higher surface and contact resistance of the silicon based emitters. The rate of oxide layer growth is variable and dependent from many ambient atmospheric factors like oxygen and ozone concentration (see, “Silicon oxidation by ozone” at the web link http://iopscience.iop.org/0953-8984/21/18/183001/pdf/cm9_18_183001.pdf), temperature, moisture, and so on. Ozone is one of the byproducts of corona discharge and may accelerate oxidation of a silicon emitter. This phenomenon has a profound effect for relatively low power voltage of HF ionizers with silicon based non-metallic emitters. An exemplary embodiment of the invention includes surface treatment of a silicon based emitter to decrease contact resistance between the emitter and metallic socket.

FIG. 1(a) is an illustration of a conventional silicon emitter 100 a. The emitter 100 a comprises four distinctive parts: tip 101 a, taper 102 a, shaft 103 a, and tail 104 a. The shape and size of the tip 101 a depends on the available amount of high voltage and current from HVPS (high voltage power supply), material of the emitter as well as technology and methods of production. The emitter tip 101 a is usually the most critical part of any ion emitter. The emitter tip 101 a is directly exposed to corona discharge and determines the life span of the emitter. Silicon emitters has a generally cylindrical shaft 103 a. The shaft 103 a mainly defines the length of the emitter and distance between the taper and socket or receptacle connected to the high voltage power supply. The taper or cone 102 a is a transitional part between the tip 101 a and shaft 103 a. Silicon is a brittle material by nature and the taper angle is a compromise of mechanical strength and electrical characteristics of the emitter. Tail 104 a may be rounded, beveled, or chamfered. This part should assist in inserting the emitter 100 a into a socket or receptacle. Standard high purity silicon emitters have a smooth surface as a result of chemical polishing (which is usually achieved by strong acid treatment).

FIG. 1(b) shows an illustration of a silicon emitter with a metallic sleeve. The silicon emitter 100 a comprises a non-metallic silicon part 101 b and stainless steel tube 102 b (or sleeve 102 b) with a dimple 105 b. The sleeve 102 b should protect the brittle silicon emitter 101 a from mechanical (handling) damage. The sleeve 102 b also should improve electrical connection of a non-metallic high purity silicon emitter and metallic sockets or receptacles. Views 103 b and 104 b show the assembled drawings of a silicon emitter 100 a with metallic sleeve 102 b. View 106 b presents a cross section of the assembled emitter shaft 103 a.

A big part (or a significant portion) of the silicon shaft 103 a is encased into metal sleeve 102 b as it is shown in view 103 b. To fix the sleeve 102 b on the silicon shaft 103 a and achieve reliable electrical contact between them it is common to make at least one protrusion 105 b (dimple) on the sleeve 102 b. Taking into consideration the tolerances in dimensions of all three components (diameter of silicon emitter shaft, inner diameter of the sleeve and depth of the dimple) the assembly operation is quite challenging (see cross sectional view silicon shaft and dimple on view 106 b).

FIG. 1(c) shows an illustration of another design of a silicon emitter 100 c. The emitter part 101 c is shown with a surface oxidation layer (“skin”) 102 c presented by a dashed line. The emitter 100 c comprises a silicon part 101 c and sleeve 103 c with dimple 104 c. Sleeve 103 c may have one or more sections/extension parts 106 c with grooves 107 c. The emitter assembly is shown in view 105 c. This design permits to keep the emitter in nozzles and uses extension parts 106 c for inserting extension parts 106 c into different sockets or receptacles.

FIG. 2 shows an illustration of a conventional DC room ionization system 200 similar to that used in U.S. Pat. No. 5,447,763. The ionizer has a couple of rods, positive (+) rod 201 and negative rod (−) 202, carrying single crystal silicon emitters. The rods are connected to dedicated positive and negative high voltage power (HVDC) supplies 203 (placed in a chasse). Cross sectional view of the emitter rod is shown in view 204. The end part of the rod 202 has a socket type connector 205 and a high voltage cable 206 connected to the HV DC power supplies 203. The socket 205 accommodates a silicon type emitter 207 shown in view 204. Other parts of the rod 202 serve as protectors of the emitter 207, connector 205 and HV cable 206 from a destructive force. The rod design makes the silicon emitters 201, 202 to be exchangeable.

At least some goals of exemplary embodiments of the invention are to suggest low particle emission, by economical silicon based charge neutralization systems. A composition of a silicon based emitter which has less than 99.99% and more than 70% silicon by weight in combination with high frequency corona discharge make the goal of low particle emission achievable. For a non-metallic silicon electrode in the ionization system, the next primary goal is to provide a reliable electrical connection between the silicon based emitter and HF high voltage power supply.

FIG. 3(a) shows an illustration of a silicon based emitter 300 a according to an embodiment of the invention, wherein the emitter 300 a comprises an abrasive portion or sand casting treated portion 310 a (i.e., treated surface section 310 a) of shaft 301 a which can be inserted in a high voltage socket (not shown). This portion 310 a of the shaft surface 302 a has roughness H in the range of approximately 0.5 micron to 10 micron (see view 303 a). During surface treatment, for example by sanding, the oxide “skin” previously on the shaft surface 302 a will be destroyed and deleted or otherwise removed. Sanding creates an emitter shaft surface profile which is able make multi-spot contacts with the high voltage socket (not shown). Optionally, similar surface treatment can be applied to the rounded end 304 a of the tail 314 a of the emitter 300 a. The emitter tip 305 a, taper 306 a, and part 311 a of the shaft 301 a has regular chemically polished surfaces.

One more embodiment of a silicon based emitter is illustrated in FIG. 3(b). According to this embodiment of the invention, the silicon based emitter 300 b comprises a portion 310 b (i.e., treated surface section 310 b) of the emitter shaft 301 b having a metallic plating or metallic coating 302 b (or conductive plating or metallic coating 302 b) which makes the portion 310 b of the shaft 301 b to be a good surface conductor and protect contact portion 316 of emitter 300 b from oxidation in the long term. The contact portion 316 can be in the tail 314 b of the emitter shaft 301 b.

Different known methods of silicon plating (e.g., like vacuum deposition, electrolytic plating, spraying, and others) can be used. Plating materials like metals may include: e.g., nickel, brass, silver, gold, and other metals as well as alloys acceptable in semiconductor industry.

FIG. 3(c) shows an illustration of a silicon-containing emitter and an apparatus to monitor the surface electrical resistance and/or volume electrical resistance of the silicon-containing emitter, in accordance with an embodiment of the invention. This shows an example of an electrical quality control operation of silicon based emitters 300 c as shown in FIG. 3(c). The control and/or monitoring include electrical resistance measurements or monitoring the electrical resistance and/or composition of the emitter 300 c or a treated surface section 302 c of the emitter 300 c. Conductive electrodes 303 c and 304 c are attached to or connected to the sanded parts 302 c (or treated surface section 302 c) of emitter shaft 301 c and tail 314 c, respectively, of the emitter 300 c. Standard resistance R measuring device 305 can be used to make and record measurements of the electrical resistance R. This way, complex surface and volume resistivity and the emitter composition can be monitored. The required normal quality and composition (with less than 99.99% to at least 70% silicon by weight) silicon based emitters should have complex resistance in kilo ohms range. After surface treatment and control operation the emitter 300 c can be inserted into a standard metallic socket (not shown) to minimize formation of new layers of silicon oxide “skin”.

At least some of the exemplary embodiments shown herein allow solving of two fold problems: (1) creating reliable electrical connection between non-metallic silicon based emitters and sockets; and (2) protecting the contacting portion of the emitter from oxidation.

FIGS. 4(a) and 4(b) show illustrations of a silicon-containing emitter with two variants of radial compression spring sleeves and metal pins, in accordance with various embodiments of the invention. The silicon-containing emitter and metal pin are inserted into the sleeve, as discussed below. The silicon based emitter 400 a of FIG. 4(a) in an embodiment of the invention will first be described. According to this exemplary embodiment, the emitter 400 a comprises the emitter part 401 a wherein the silicon portion of the emitter part 401 a has a reduced length/shaft diameter ratio. The short silicon based emitter part 401 a is connected to a metal radial compression spring sleeve 402 a from one side 430 of the sleeve 402 a. The other side 431 of the sleeve 402 a is connected to a solid metal extension pin 403 a. The metal pins 403 a and 403 b discussed herein can be metal electrodes 403 a and 403 b that are inserted into spring type sleeves 402 a and 402 b, respectively. This pin 403 a may have at least one (or more) groove and a variable length “L2” required by the socket and an ionization cell (including reference electrode) design. For example, the pin 403 a includes grooves 435 and 436, although the pin 403 a may only have a single groove in other embodiments. The pin 403 a can be, for example, a solid metal pin or tube. Conventional, CNC, or automatic metal cutting machines, or other metal proceeding methods can be used to manufacture a pin 403 a. View 405 a shows an illustration or drawing of the emitter assembly 410 a with the silicon emitter 400 a according this exemplary embodiment. Radial compression spring sleeve 402 a has significantly bigger contact area with silicon part 401 a compared with the conventional sleeve 102 b with the dimple 105 b as shown in FIGS. 1(a) and 1 (b). The result is more reliable electrical connection and less mechanical stress applied to a brittle silicon emitter part 401 a. The design of silicon emitter with metal sleeve has some requirements to prevent “secondary” corona discharge from an edge of the sleeve to a nearby reference electrode. Main parameters which should be taken into consideration are illustrated in view 406 a: D which is a diameter of the silicon emitter shaft 440; L which is a length of exposed portion 441 of the silicon emitter shaft 440; a which is an angle of the taper of tapered portion 442 of the shaft 440; and S which is the thickness of the sleeve 402 a. For a high concentration electrical field on the emitter tip 421 a of silicon part 401 a (or on the emitter tip 421 b of silicon part 401 b), the first ratio S/D should be in the range of approximately 0.03 to 0.06. Another requirement related to the distance between the emitter tip 421 a and sleeve 402 is the second ratio L/S: the ratio L/S should be in the range (2−5)/tan {tangent}(0.5α). The parameter a is an angle of a taper of a tapered portion of the shaft 440 of the at least one non-metallic emitter part 401 a or 401 b. These conditions of a new silicon emitter design in one embodiment of the invention will satisfy several criteria/specifications: reliable electrical connection, good mechanical strength, and minimum possibility of “secondary” corona will generate particles emission from metal parts.

FIG. 4(b) shows an illustration of another embodiment of a silicon based emitter 400 b comprising another configuration of a metal radial compression spring sleeve 402 b. In this case, the emitter 400 comprises a silicon emitter part 401 b has a diameter D1 and one end 461 of metal sleeve 402 b has a diameter D3. Silicon emitter part 401 b has an emitter tip 421 b. Part 403 b is a solid metal pin 403 b which has diameter D4 and another end 462 of the sleeve 402 b has a diameter D2. Differences in diameters (D1>D3) of silicon emitter part 401 b and metal sleeve 402 b create a required compression force to provide a reliable or good electrical contact between the silicon part 401 b and metal sleeve 402 b. Similarly, differences in diameters (D2<D4) provide a reliable or good electrical connection between metal sleeve 402 b and metal pin 403 b. Views 404 b and 406 b show assembled views of the silicon emitter 400 b. View 405 b is a cross sectional view which shows, according to this exemplary embodiment, the silicon emitter 401 b and sleeve sections 402 b having big contact areas with minimum contact pressure and local stress. The assembly operation is simplified. Both exemplary embodiments (emitters 400 a and 400 b) use a minimum amount of expensive silicon based material, have big reliable contact areas of non-metallic emitter shaft with metal sleeves, and good dimensional matching to standard sockets or receptacles.

In some cases silicon based emitters have problem to start high frequency corona discharge and reliably produce ion generation in spite of having normal surface/volume electrical resistance and good electrical connection to high voltage sockets. Our experiments show that the core of this problem is due to the formation of thick isolative oxide “skin” on the surface of the emitter tip (“working horse” of the emitter). One more exemplary embodiment of this invention addresses this problem. The shape of the tip of the silicon-containing emitters may have some positive effect on the rate of formation and thickness of isolative oxide “skin”.

FIGS. 5(a), 5(b), and 5(c) show illustrations of three silicon-containing emitters that have different configurations of the taper and tip, in accordance with various embodiments of the invention. The various tip configurations and taper configurations shown in FIGS. 5(a), 5(b), and 5(c) determine an operating HF corona onset voltage and ionization current parameters.

In FIG. 5(a), there is shown a silicon based emitter 501 with a flattened truncated tip. This tip design is prone to create a ring type high frequency corona discharge (where flattened tip 510 meets the taper 511 of the emitter 501). This emitter 501 may reduce ion current density and particle emission. However, it is characterized by higher onset HF corona voltage. The taper 511 is at an angle value of α with respect to the flattened tip 510.

Silicon based emitter 502 (FIG. 5(b)) has small rounded tip 514 with a radius Z in the range of approximately 60 microns to 400 microns which is less expensive in production and minimizes corona current fluctuation. The taper portion 516 (of emitter 502) extends from the small rounded tip 514.

A sharpened silicon based emitter 503 (FIG. 5(c)) has a sharp pointed tip 520 with a radius Y in the range of approximately 40 microns to 50 microns, or less. This emitter 503 has the lowest corona onset voltage V_(on). However, the ion current density for the emitter 503 is at maximum and spattering, erosion, and oxide “skin” growths are at the highest rate. This silicon based emitter 503 preferably used for ionization in oxygen free gases like nitrogen or argon. The taper/conical portion 521 of the emitter 503 preferably has angle α in the range of approximately 10 degrees-20 degrees with respect to the sharp pointed tip 520. All silicon based emitters (501, 502, 503) have a composition according to exemplary embodiments of this invention and are able to provide low particle counts when installed in in-line ionizers, ionizing bars, and other charge neutralizers driven by the HF AC voltages. The degree of sharpness and the curvature of the tip (i.e., configuration of the tip) affect or determine ionizer operating parameters including onset voltage, ion current, and ion balance, but they do not affect the scope of the instant invention.

One more exemplary embodiment of this invention addresses oxide “skin” growth on the silicon emitter tip. The embodiment uses specific mode of corona discharge to clean the silicon emitter tip from the oxide skin and help ionizer start up independently from the emitter profile.

FIG. 6 shows an illustration of an HF waveform to perform “soft” plasma cleaning of a silicon-containing emitter tip during a “start up” of a corona ionization period, in accordance with an embodiment of the invention.

The high voltage “HF startup” type waveform 600 is applied to the emitter. This mode of high voltage drive provides a group (numbered from 1 to up to several hundred bipolar pulses 605) of short duration bipolar voltage bursts to the emitter during the start-up period (marked as a Is period). Thanks to the very short duration of power profile in the range milliseconds, microseconds or less, the HF corona associated plasma has very limited energy. This way prevents both a rising temperature of the emitter tip and a surface destruction (spattering, erosion, and particle emission) of the emitter tip. Short duration HF plasma bursts performs only “soft” cleaning of the emitter tip from silicon oxide skin. The duration of the “startup” time period Ts, burst pulse amplitude, and the number of pulses may vary and depend from thickness of the silicon oxide skin, gas media, emitter tip design, and so on. The voltage amplitude of HF burst pulses is significantly higher (approximately 25% to 100% or more) than normal (operational) corona onset voltages positive (+)Von and negative (−)Von (shown in FIG. 6 by two dash horizontal lines 610 and 615, respectively). The initial “startup” mode helped to start normal/operational high frequency corona discharge and ion production. During normal/operational mode (during time Top), the high voltage amplitude can be only 10%-20% higher than corona onset voltages (+)Von or (−)Von to minimize particle emission. In continuous operation mode the HF corona discharge is able to protect silicon emitter from oxidation in clean dry gas media. Therefore, soft plasma cleaning of the at least one non-metallic emitter is performed during a start up period of a corona ionization period by a voltage/power waveform different from a voltage/power waveform during an operational period.

FIGS. 7(a), 7(b), and 7(c) show illustrations of examples of high frequency power voltage wave forms applied to a silicon based emitter during an operational mode, in accordance with an embodiment of the invention. The different operational HF voltage waveforms effectively create bipolar ionization for silicon based emitters. The function of the high frequency AC voltage is to create both polarity ions (positive ions and negative ions) at a minimum driving voltage. To create ions, the peak voltages (positive and negative peak voltages) exceed the corona onset voltages. As shown in FIG. 7(a), the high frequency AC voltage profile 700 is continuous, but the profile may also be modulated continuous or non-continuous and periodic.

FIG. 7(a) presents a continuous sign wave type powering voltage 700 which may have a frequency range from approximately 1 kHz up to approximately 100 kHz. Positive and negative voltage amplitudes of the voltage 700 are higher than positive corona onset voltage (+)Von 705 and lower than the negative corona onset voltage (−)Von 710. This voltage type waveform 700 provides maximum power to the silicon based emitter described herein and create maximum ion current.

FIG. 7(b) shows an illustration of a voltage waveform 750 comprising groups of pulse trains 752 with “on” periods 755 and “off” periods 756. The waveform 750 comprises at least one modulation portion, wherein each modulation portion comprises a pulse train 752 having an on period 755 and an off period 756. During an on period 755 in a pulse train 752, the waveform 750 has an amplitude 758 that exceeds the positive corona onset voltage threshold 705 and that exceeds the negative corona onset voltage threshold 710 for a particular emitter. During an off period 756 in a pulse train 752, the waveform 750 has an amplitude 760 that does not exceed the corona onset voltage thresholds 705 and 710. In the example of FIG. 7(b), this amplitude 760 is a voltage magnitude of approximately zero. Additional details of the waveforms 700, 750, and 780 in FIGS. 7(a), 7(b), and 7(c), respectively, are also described in commonly-owned and commonly-assigned U.S. Pat. No. 8,009,405 to Peter Gefter et al. During “off” periods 756 (which can be small duty factor), corona discharge (ion production) and particle emission stops. The duty factor can be variable in the range from approximately 100% down to approximately 0.1% or less depending upon a required ion output. A minimal duty factor helps to suppress particle emission and emitter erosion rate.

FIG. 7(c) shows an illustration of another variant of voltage waveform 780 where a duty factor is close to approximately 100%, but the voltage amplitude applied to the silicon emitter periodically drops to values lower than the corona onset voltage (in the range of approximately 90% to approximately 50% or less from corona onset voltage). An advantage of this waveform is that it may minimize both particle emission and high voltage swing (voltage/electrical field variation).

The waveform 780 comprises at least one modulation portion, wherein each modulation portion comprises a pulse train 782 having an on period 785 and a non-operation period 786. During an on period 785 in a pulse train 782, the waveform 780 has an amplitude 788 that exceeds the positive corona onset voltage threshold ((+)Vmax) 705 and that exceeds the negative corona onset voltage threshold ((−)Vmax) 710 for a particular emitter. During a non-operation period 786 in a pulse train 782, the waveform 780 has an amplitude 790 that does not exceed the corona onset voltage thresholds 705 and 710, but the amplitude 790 is more than zero volts.

FIGS. 8(a) and 8(b) show illustrations of examples of modulated high frequency voltage wave forms, in accordance with an embodiment of the invention. FIG. 8(a) presents a continuous modulated waveform 800 as a result of mixing (combination) of high frequency and low frequency voltages. The low frequency component (or offset voltage) is shown in FIG. 8(b). This voltage waveform 850 predominately creates ions by a high frequency component (similar to the waveform 700 shown in FIG. 7(a)) and moves ions from the emitter by the low frequency component.

In-line ionizers with silicon based emitters can be used in the most critical operations/processes (e.g., environments like Airborne Particulate Cleanness Class 1) in the semiconductor industry. FIGS. 9(a), 9(b), and 9(c) present illustrations of simplified views of ionization cells and block diagrams of the in-line ionizer. With an in-line ionizer design, the application of the HF frequency voltage may be similar to the waveform shown in FIG. 8(a) with extended in range from approximately 20 kHz to upward of approximately 100 kHz.

FIG. 9(a) shows an illustration of an ionizing cell/chamber of an in-line ionizer, in accordance with an embodiment of the invention. A high frequency AC powered silicon based emitter 902 a generates both polarity ions. An air/gas flow 908 a is moving the stream of ions from the emitter 902 a. Also shown in FIG. 9(a) an ionization cell 900 a is connected to HF HV generator 901 a. Silicon based emitter 902 a is positioned in a socket 903 a and is connected via capacitor (C1) which is connected to the HF generator 901 a. The emitter 902 a may have sanded or metal plated portion of the shaft as previously discussed in FIG. 3(a) and FIG. 3(b), respectively, to provide reliable connection to socket 903 a.

The emitter 901 a is typically positioned in the middle part of air/gas channel 904 a. Preferably, the reference electrode 905 a positioned on an outer side of the channel 904 a and close to the outlet 906 a of channel 904 a. The reference electrode 905 a is connected to control system 907 a. Positive ions 920 and negative ions 921 are generated by the emitter 901 a when the peak voltages (positive or negative voltages) of the high frequency AC voltage (applied to emitter 901 a) exceed the corona onset voltage. Air/gas flow 908 a from an external source (not shown) still need to move a generated ion cloud toward distant target charge neutralization (not shown). Corona discharge near the tip 909 a of the emitter 902 a creates intense HF plasma 910 a with ions and electrons near the tip 909 a of silicon emitter 902 a. The corona onset voltage is approximately (+) 5 to 6 kV for positive ions and (−) 4.5 to 5.5 kV for negative ions.

Generation/emission corona byproducts like particles in plasma are minimized by methods, apparatuses, and means previously discussed as the combination of ion emitter composition, ion emitter design, and powered voltage waveforms.

FIG. 9(b) shows an illustration of another view 900 b of the ionization cell and gas channel in a block 901 b, in accordance with an embodiment of the invention. The channel 902 b has an inlet 933 b and an outlet 934 b. The silicon based emitter 905 b with socket 906 b can be made as an exchangeable unit positioned in a cavity 960 of the channel 902 b. The emitter socket 906 b and reference electrode 907 b are connected to high voltage HF power supply 908 b. Ionized gas flow (shown by arrows 961) are moving ion clouds to the charged target 909 b like wafer and the ion clouds will neutralize these charges 965 on the charged target 909 b.

FIG. 9(c) shows a simplified block diagram of an in-line ionizer 900 c with a silicon based emitter 904 c, in accordance with an embodiment of the invention. Positive and negative ions 901 c are created inside the ionization cell 902 c. A high voltage HV-HF power supply 903 c provides the voltage and current needed to generate the ions 901 c. The power supply 903 c delivers a high frequency AC voltage to the silicon based emitter 904 c through capacitor C1. Voltage on the silicon based emitter 904 c is relative to a reference electrode 905 c.

A pressurized source of air, nitrogen, or argon is connected to the in-line ionizer 900 c via an inlet to create an air flow or gas flow 906 c. The air flow or gas flow 906 c entrains positive and negative ions 901 c and carries the ions 901 c through the ionizer outlet 934 c toward a target (e.g., target 909 b in FIG. 9(b)).

The in-line ionizer 900 c includes a control system 907 c comprising a microprocessor 908 c, gas pressure sensor 909 c, corona discharge sensor 910 c, and operation status indicators 911 c. The in-line ionizers 900 c are often working in semiconductor tools having wafers load/unload operations. That is why the in-line ionizers 900 c may have a relatively long idle (“stand off”) periods without corona discharge and gas flow. During those time periods the tip of silicon emitter may grow silicon oxide layer. As previously discussed in an exemplary embodiment illustrated in FIG. 3(a) and FIG. 6, the control system 907 c initiates gas ionization process by starting the high voltage power supply 903 c in the “startup” mode. The corona discharge sensor 905 c and processor 908 c are continuously monitoring the status of corona discharge up to the point when a strong and stable corona and ion production are achieved. After that, the control system 907 c and power supply 903 c are switched to the normal operation mode.

FIGS. 10(a), 10(b), 10(c), and 10(d) show illustrations of a simplified structure of a high frequency AC ionizing bar 1000 a, and details of nozzles with silicon based ion emitters, in accordance with an embodiment of the invention. FIGS. 10(a) and 10(b) shows views of a high frequency AC ionizing bar 1000 a with a plurality of raw silicon based emitters 1001 a through 1008 a (as an example). Each silicon emitter has a stainless steel sleeve. The stainless steel sleeve is shown as sleeve 1020 c in FIG. 10(c), and as sleeve 1020 d in FIG. 10(d). Each stainless steel sleeve 1020 a is installed in a nozzle. Each nozzle has socket and optionally one or two air/gas jet orifices. Cross sectional view of the nozzles are shown as nozzles 1030 c in FIGS. 10(c) and 1030(d) in FIG. 10(d).

The socket 1009 c is connected to a common high voltage bus and the orifices to manifold (not shown) both located inside enclosure 1010 a of the ionizer bar 1000 a. The cross-sectional view 1040 of the nozzle 1030 d shows the relative position of the silicon emitter 1003 d (with sleeve and groove as previously discussed in FIGS. 4(a) and 4(b)) and orifices 1004 d. The bus distributes HF power from the high voltage AC power supply to each nozzle and emitter. The HF-HV power supply with microprocessor based control system is preferably position inside the same enclosure 1010 a. The silicon based ion emitters receive HF AC voltages in the range of approximately 6 kV to 8 kV with basic frequency at approximately 10 kHz to 26 kHz (similar to shown in FIG. 7(a)). This HF high voltage creates corona discharge between each emitter 1001 a through 1008 a and reference electrode 1011 a. This high frequency AC voltage is sufficient in itself to create a clean bipolar ionization when the composition of the emitter is in the range from less 99% to with greater than 70% silicon are employed. As previously discussed the high frequency itself is not able to move ion cloud far away. HF ionizing bars 1000 a often installed in flat panel or semiconductor tools at relatively short distance (e.g., approximately 50 mm to 300 mm) from targets. The electrical field of charged target (not shown) attracts ions opposite polarity in this case. However, for efficient charge neutralization at longer distances (e.g., approximately 400 mm to 1500 mm) ions cloud requires assistance from an air/gas flow or an electrical field, or combination of both. Often HF ionizing bars can be used in combination with HEPA filters providing clean laminar air flow.

FIG. 8a shows modulated HF waveform 800 which creates an additional low frequency field (with a frequency of approximately 0.1 Hz to 200 Hz) to help ion delivery to the target. During periods T2 the amplitude 802 of positive voltage wave 804 and amplitude 806 negative voltage wave 808 are almost equal, and so the offset voltage is close to zero and ion clouds oscillate near silicon emitters. In contrast, during periods like T1 the voltage waveform 800 has a positive offset 810 and positive polarity ion clouds (which are repelled) are moving to the target (see FIG. 8(b)). Similarly, during time periods like T3 voltage waveform 800 has a negative offset 815 and negative polarity ion clouds (which are repelled) are moving to the target. The amplitude and frequency of offset voltages depends from distance between ionizing bar 1000 a and target.

High frequency ionizing bars 1000 a with silicon based emitters are able to create low emission, to create clean air/gas ionization, and to neutralize charges of fast moving large objects (like flat panels) at distances of, for example, approximately 400 mm up to 1500 mm.

Another embodiment of the invention provides a method for low emission charge neutralization, wherein the at least one above-described non-metallic emitter comprises a reduced silicon section length/shaft diameter ratio.

Another embodiment of the invention provides a method for low emission charge neutralization, wherein the above-described sleeve comprises a metal radial compression spring sleeve and wherein differences in diameters of the at least one emitter, metal pin, and sleeve create a compression force that provide a reliable electrical connection between the at least one emitter, sleeve, and metal electrode.

Another embodiment of the invention provides an apparatus for low emission charge neutralization, wherein the at least one above-described non-metallic emitter comprises a reduced length/shaft diameter ratio.

Another embodiment of the invention provides an apparatus for low emission charge neutralization, wherein the above-described sleeve comprises a metal radial compression spring sleeve and wherein differences in diameters of the at least one emitter, metal pin, and sleeve create a compression force that provide a reliable electrical connection between the at least one emitter, sleeve, and metal electrode.

Another embodiment of the invention provides an apparatus for and method of creating reliable, low-particle emission charge neutralizers by combining: non-metallic ion emitters having chemical composition in the range between less than 99.99% to at least 70% silicon by weight, emitter geometry, and surface treatment (preparation), and a connection arrangement between the emitter and a high voltage power supply operating in high frequency range. In this combination the emitter reliably generates the high frequency corona discharge featured by low onset voltage and low particle emission. This combination is effective for many different type clean room ionizers/charge neutralizers targeted for clean rooms of class 1. The combination of silicon-containing emitters and a high frequency AC voltage produces ionizers that are cleaner than conventional ionizers, based on particles counts greater than 10 nanometers. This improvement in cleanliness has been experimentally determined by the inventors.

The above description of illustrated embodiments of the invention, including what is described in the Abstract, is not intended to be exhaustive or to limit the invention to the precise forms disclosed. While specific embodiments of, and examples for, the invention are described herein for illustrative purposes, various equivalent modifications are possible within the scope of the invention, as those skilled in the relevant art will recognize.

These modifications can be made to the invention in light of the above detailed description. The terms used in the following claims should not be construed to limit the invention to the specific embodiments disclosed in the specification and the claims. Rather, the scope of the invention is to be determined entirely by the following claims, which are to be construed in accordance with established doctrines of claim interpretation. 

1. A method for low emission charge neutralization, comprising: generating an alternating current (AC) and a high voltage; transmitting the high voltage to at least one point type silicon based non-metallic ion emitter configured with a tip, a taper, a shaft, and a tail; wherein the taper is between the tip and the shaft; wherein the shaft is between the taper and the tail; wherein the high voltage and alternating current is in a high frequency range of 1 kilohertz to 100 kilohertz; wherein the at least one point type silicon based non-metallic ion emitter comprises more than 72.00% silicon by weight and less than 99.99% silicon by weight; wherein the at least one point type silicon based non-metallic ion emitter comprises at least a portion of treated surface of the shaft or/and tail with an increased surface conductivity or a lower electrical resistance; and generating ions from the tip of the emitter in response to a contact of the treated surface of the shaft or/and tail of the emitter to the high voltage and the alternating current in the high frequency range.
 2. The method of claim 1, wherein the portion of treated surface of the shaft or/and tail of the at least one point type silicon based non-metallic ion emitter comprises an area with a preselected roughness in a range of 0.5 micron to 10 microns due to abrasive or sanding processing.
 3. The method of claim 1, wherein the portion of treated surface of the shaft or/and tail of the at least one point type silicon based non-metallic ion emitter comprises a metallic plating or metallic coating.
 4. The method of claim 1, further comprising: providing a measuring device for monitoring a surface or/and volume electrical resistance and composition of the at least one point type silicon based non-metallic ion emitter.
 5. The method of claim 1, wherein the shaft of the emitter comprising a silicon based section and a metal electrode are inserted into a spring type sleeve.
 6. (canceled)
 7. The method of claim 1, further comprising: performing a plasma cleaning of the at least one point type silicon based non-metallic ion emitter during a start up period of a corona plasma ionization generated by a voltage/power waveform comprising short duration pulses bursts with an amplitude that is 25% to 100% higher than a voltage/power waveform during a normal (operational) period.
 8. The method of claim 1 wherein to minimize particle emission by the ion emitter, applying to the ion emitter a corona discharge voltage waveform with a minimum onset HF voltage amplitude and/or a lower duty factor during an operational period.
 9. The method of claim 1, wherein the at least one point type silicon based non-metallic ion emitter comprises an assembly of a non-metallic part/portion and a metallic part/portion; wherein the metallic part/portion is constructed as a compressing spring sleeve positioned on the shaft of the non-metallic ion emitter; wherein the assembly comprises a first ratio S/D in a range from approximately 0.03 to 0.06; wherein S is a thickness of the sleeve that receives the at least one point type silicon based non-metallic ion emitter; and wherein D is a diameter of the shaft of the at least one point type silicon based non-metallic ion emitter.
 10. The method of claim 1, wherein the at least one point type silicon based non-metallic ion emitter comprises a second ratio L/S in the range (2−5)/[tan {tangent}(0.5α)]; wherein L is a length of an exposed portion of a shaft of the at least one point type silicon based non-metallic ion emitter; wherein S is a thickness of a sleeve that receives the at least one point type silicon based non-metallic ion emitter; and wherein α is an angle of a taper of a tapered portion of the shaft of the at least one point type silicon based non-metallic ion emitter.
 11. An apparatus for low emission charge neutralization, comprising: at least one point type silicon based non-metallic ion emitter configured with a tip, a taper, a shaft, and a tail; wherein the taper is between the tip and the shaft; wherein the shaft is between the taper and the tail; wherein the at least one point type silicon based non-metallic ion emitter comprises more than 72.00% silicon by weight and less than 99.99% silicon by weight; wherein the at least one point type silicon based non-metallic ion emitter comprises at least a portion of treated surface of the shaft or/and tail with an increased surface conductivity or a lower electrical resistance; and wherein the tip of the emitter generates ions in response to a contact of the treated surface of the shaft or/and tail of the emitter to a high voltage and an alternating current (AC) in a high frequency range of 1 kilohertz to 100 kilohertz.
 12. The apparatus of claim 11, wherein the portion of treated surface of the shaft or/and tail of the at least one point type silicon based non-metallic ion emitter comprises an area with a preselected roughness in a range of 0.5 micron to 10 microns due to abrasive or sanding processing.
 13. The apparatus of claim 11, wherein the portion of treated surface of the shaft or/and tail of the at least one point type silicon based non-metallic ion emitter comprises metallic plating or metallic coating.
 14. The apparatus of claim 11, wherein a surface or/and volume electrical resistance and composition of the at least one point type silicon based non-metallic ion emitter is monitored.
 15. The apparatus of claim 11, wherein the shaft of the emitter comprising a silicon based section and a metal electrode are inserted into a spring type sleeve.
 16. (canceled)
 17. The apparatus of claim 11, wherein a soft plasma cleaning of the at least one point type silicon based non-metallic ion emitter is performed during a start up period of a corona plasma ionization generated by a voltage/power waveform comprising short duration pulses bursts with an amplitude that is 25% to 100% higher than a voltage/power waveform during a normal (operational) period.
 18. The apparatus of claim 11 wherein to minimize particle emission by the ion emitter, a corona discharge voltage waveform with a minimum onset HF voltage amplitude and/or a lower duty factor is applied to the ion emitter during an operational period.
 19. The apparatus of claim 11, wherein the at least one point type silicon based non-metallic ion emitter comprises an assembly of a non-metallic part/portion and a metallic part/portion; wherein the metallic part/portion is constructed as a compressing spring sleeve positioned on the shaft of the non-metallic ion emitter; wherein the assembly comprises a first ratio S/D in a range from approximately 0.03 to 0.06; wherein S is a thickness of the sleeve that receives the at least one point type silicon based non-metallic ion emitter; and wherein D is a diameter of the shaft of the at least one point type silicon based non-metallic ion emitter.
 20. The apparatus of claim 11, wherein the at least one point type silicon based non-metallic ion emitter comprises a second ratio L/S in the range (2−5)/[tan {tangent}(0.5α)]; wherein L is a length of an exposed portion of a shaft of the at least one point type silicon based non-metallic ion emitter; wherein S is a thickness of a sleeve that receives the at least one point type silicon based non-metallic ion emitter; and wherein α is an angle of a taper of a tapered portion of the shaft of the at least one point type silicon based non-metallic ion emitter.
 21. An apparatus, comprising: a silicon based non-metallic ion emitter configured with a tip, a taper, a shaft, and a tail; wherein the taper is between the tip and the shaft; wherein the shaft is between the taper and the tail; wherein the silicon based non-metallic ion emitter comprises more than 72.00% silicon by weight and less than 99.99% silicon by weight; and wherein the silicon based non-metallic ion emitter comprises at least a portion of treated surface of the shaft or/and tail with a higher electrical conductivity or a lower resistivity than the taper and tip.
 22. The apparatus of claim 21, wherein the tip of the emitter generates ions in response to a contact of the treated surface of the shaft or/and tail of the emitter to a high voltage and an alternating current (AC) in a high frequency range of 1 kilohertz to 100 kilohertz. 